Supermicro 8U 15Bays Dual Processor Rackmount Server

Supermicro 8U 15Bays Dual Processor Rackmount Server

5th/4th Gen Intel® Xeon® Scalable processor support
32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
8 PCIe Gen 5.0 X16 LP, 2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional)
Flexible networking options
2 M.2 NVMe for boot drive only, 16x 2.5" Hot-swap NVMe drive bays (12x by default, 4x optional), 3x 2.5" Hot-swap SATA drive bays, Optional: 8x 2.5" Hot-swap SATA drive bays
10 heavy duty fans with optimal fan speed control
Optional: 8x 3000W (4+4) Redundant Power Supplies, Titanium Level 6x 3000W (4+2) Redundant Power Supplies, Titanium Level
High Performance Computing, AI/Deep Learning Training, Industrial Automation, Retail, Healthcare, Conversational AI, Business Intelligence & Analytics, Drug Discovery, Climate and Weather Modeling, Finance & Economics

To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, Min of 2TB Memory for HGX-H100-8 GPU's, 1 storage Device and 1 NIC including in IO board). Service OSNBD3 is highly recommended.

Note: Image above may show a varied configuration or optional part. Please refer to parts list for standard parts included.

SKU	SYS-821GE-TNHR
Processor	CPU: Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Core Count: Up to 64C/128T; Up to 320MB Cache per CPU Note: Supports up to 350W TDP CPUs (Air Cooled) Supports up to 385W TDP CPUs (Liquid Cooled) Max GPU Count: Up to 8 onboard GPU(s) Supported GPU: NVIDIA SXM: HGX H100 8-GPU (80GB) CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect GPU-GPU Interconnect: NVIDIA® NVLink® with NVSwitch™ Certification: NVIDIA CERTIFIED
Memory	Memory: Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM Memory Voltage: 1.1V
Chassis	8U Rackmount Chassis
Dimensions	Height: 14" (355.6 mm) Width: 17.2" (437 mm) Depth: 33.2" (843.28 mm)
Front Panel	LED: Hard drive activity LED Network activity LEDs Power status LED System Overheat & Power Fail LED Buttons: Power On/Off button System Reset button
Bios	BIOS Type: AMI 32MB SPI Flash EEPROM
Onboard Devices	Chipset: Intel® C741 Network Connectivity: 2 RJ45 10GbE with Intel® X550-AT2 (optional) 2 SFP28 25GbE with Broadcom® BCM57414 (optional) 2 RJ45 10GbE with Intel® X710-AT2 (optional) NVMe
HDD Drive Bays	Drive Bays Configuration: Default: Total 15 bay(s) 12 front hot-swap 2.5" NVMe drive bay(s) 3 front hot-swap 2.5" SATA drive bay(s) Option A: Total 19 bay(s) 12 front hot-swap 2.5" NVMe drive bay(s) 4 front hot-swap 2.5" NVMe drive bay(s) 3 front hot-swap 2.5" SATA drive bay(s) (NVMe support may require additional storage controller and/or cables, please see the optional parts list for details) M.2: 2 M.2 NVMe slot(s) (M-key)
Expansion Slots	PCI-Express (PCIe) Configuration: Default 8 PCIe 5.0 x16 LP slot(s) 2 PCIe 5.0 x16 FHHL slot(s)
Power Supply	1x 3000W Redundant Titanium Level power supply Dimension (WxHxL): 106.5 x 82.1 x 245.5 mm +12V: Max: 91.66A / Min: 0A (200Vac-240Vac) 12V SB: Max: 3A / Min: 0A AC Input: 3000W: 207-240Vac / 50-60Hz Output Type: Backplanes (gold finger)
Input Output	Video: 1 VGA port(s)
Cooling	Fans: 10 heavy duty fans with optimal fan speed control Liquid Cooling: Direct to Chip (D2C) Cold Plate (optional)
Operating Environment	Environmental Spec. Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)